Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system. Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Products specifications
Attribute name | Attribute value |
---|
Maximum internal memory | 786432 MB |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Tcase | 87 °C |
Processor base frequency | 2.10 GHz |
Intel® Optane™ Memory Ready | N |
Harmonized System (HS) code | 85423119 |
Market segment | Server |
Product family | Intel Xeon Processors |
Intel® Speed Shift Technology | Y |
Memory clock speeds supported by processor | 2666 MHz |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Intel® vPro™ Platform Eligibility | Y |
Status | Launched |
Intel Turbo Boost Max Technology 3.0 | N |
Component for | 24 |
Memory channels | 36 |
ECC | Y |
Product type | 4 |
Processor ARK ID | 2666 MHz |
Processor model | 6130 |
Processor boost frequency | 3.70 GHz |
Processor threads | 32 |
Processor cache | 22528 KB |
Processor code | SR3B9 |
Scalability | S4S |
Stepping | H0 |
Thermal Design Power (TDP) | 125 W |
Maximum internal memory supported by processor | 768 GB |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
PCI Express slots version | 3.0 |
Processor cache type | L3 |
Processor codename | Skylake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76.0 x 56.5 mm |
Processor socket | LGA 3647 (Socket P) |
Conflict-Free processor | Y |
Embedded options available | Y |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Intel 64 | Y |
Intel Trusted Execution Technology | Y |
Intel TSX-NI | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |