Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software. Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Products specifications
Attribute name | Attribute value |
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Maximum internal memory | 786432 MB |
On-board graphics card | N |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Memory clock speeds supported by processor | 2666 MHz |
Tcase | 79 °C |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 3.20 GHz |
Intel® vPro™ Platform Eligibility | Y |
Intel® Optane™ Memory Ready | N |
Market segment | Desktop |
Status | Launched |
Product family | Intel Xeon Processors |
Intel Turbo Boost Max Technology 3.0 | N |
Intel® Speed Shift Technology | Y |
Component for | PC |
ECC | Y |
Memory channels | Hexa-channel |
Product type | 4 |
Processor ARK ID | 120493 |
Processor family | Intel® Xeon® Gold |
Processor model | 6134 |
Processor boost frequency | 3.70 GHz |
Processor cores | 8 |
Processor threads | 16 |
Processor cache | 25344 KB |
PCI Express slots version | 3.0 |
Processor cache type | L3 |
Processor codename | Skylake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76.0 x 56.5 mm |
Processor socket | LGA 3647 (Socket P) |
Scalability | S4S |
Stepping | H0 |
Thermal Design Power (TDP) | 130 W |
Maximum internal memory supported by processor | 768 GB |
Conflict-Free processor | Y |
Embedded options available | N |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Intel 64 | Y |
Intel Trusted Execution Technology | Y |
Intel TSX-NI | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |