Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system. Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Products specifications
Attribute name | Attribute value |
---|
Maximum internal memory | 786432 MB |
On-board graphics card | N |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Memory clock speeds supported by processor | 2666 MHz |
Tcase | 85 °C |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 3.00 GHz |
Intel® vPro™ Platform Eligibility | Y |
Intel® Optane™ Memory Ready | N |
Market segment | Server |
Status | Launched |
Product family | Intel Xeon Processors |
Intel Turbo Boost Max Technology 3.0 | N |
Intel® Speed Shift Technology | Y |
Component for | Server/workstation |
ECC | Y |
Memory channels | Hexa-channel |
Product type | 4 |
Processor ARK ID | 120479 |
Processor family | Intel® Xeon® Gold |
Processor model | 6136 |
Processor boost frequency | 3.70 GHz |
Processor cores | 12 |
Processor threads | 24 |
Processor cache | 25344 KB |
PCI Express slots version | 3.0 |
Processor cache type | L3 |
Processor code | SR3B2 |
Processor codename | Skylake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76.0 x 56.5 mm |
Processor socket | LGA 3647 (Socket P) |
Scalability | S4S |
Stepping | H0 |
Thermal Design Power (TDP) | 150 W |
Maximum internal memory supported by processor | 768 GB |
Conflict-Free processor | Y |
Embedded options available | N |
Enhanced Intel SpeedStep Technology | Y |
Execute Disable Bit | Y |
Intel 64 | Y |
Intel Trusted Execution Technology | Y |
Intel TSX-NI | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |