Intel Xeon D-1637 processor 2.9 GHz 9 MB

Intel Xeon D-1637. Processor family: Intel® Xeon® D, Processor socket: FCBGA1667, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM,DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 1S. USB version: 2.0/3.2 Gen 1 (3.1 Gen 1). Intel® Turbo Boost Technology 2.0 frequency: 3.2 GHz
Manufacturer: Intel
SKU: 6032838
Manufacturer part number: GG8068204237101
$618.15
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Virtualization Technology (VT-x) ‡ Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® 64 ‡ Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Intel® ME Firmware Version Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® Turbo Boost Technology ‡ Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡ Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Intel® VT-x with Extended Page Tables (EPT) ‡ Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Optane™ Memory Supported ‡ Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Transactional Synchronization Extensions Intel® Transactional Synchronization Extensions (Intel® TSX) are a set of instructions that add hardware transactional memory support to improve performance of multi-threaded software.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Virtualization Technology (VT-x) ‡ Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® 64 ‡ Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Intel® ME Firmware Version Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® Turbo Boost Technology ‡ Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡ Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Intel® VT-x with Extended Page Tables (EPT) ‡ Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Optane™ Memory Supported ‡ Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Transactional Synchronization Extensions Intel® Transactional Synchronization Extensions (Intel® TSX) are a set of instructions that add hardware transactional memory support to improve performance of multi-threaded software.
Products specifications
Attribute nameAttribute value
Commodity Classification Automated Tracking System (CCATS)G168319
Supported instruction sets2.4 GHz
Intel® Optane™ Memory ReadyLaunched
Export Control Classification Number (ECCN)5A002R
Supported memory typesDDR4-SDRAM,DDR3-SDRAM
Intel® Turbo Boost Technology 2.0 frequencyN
Tjunction105 °C
Memory clock speeds supported by processor2400 MHz
Tcase77 °C
Processor base frequency2.9 GHz
Market segmentServer
Launch dateQ2'19
Intel® Transactional Synchronization ExtensionsY
Intel QuickAssist TechnologyN
Intel® Boot GuardN
Memory speed (max)2400 MHz
General Purpose IOYes
Maximum Memory128 GB
Maximum internal memory128 GB
On-board graphics cardN
Discrete graphics card modelNot available
Discrete graphics cardN
Intel Software Guard Extensions (Intel SGX)N
Total number of SATA connectors6
Cooler includedN
Harmonized System (HS) code8542310001
BoxN
StatusLaunched
Number of SATA III connectors6
Integrated LANN
Intel ME Firmware Version3
Intel Quiet System Technology (QST)N
Features
Product typeIntel
Component forServer/workstation
ECCY
Memory channelsDual-channel
Other features
Processor ARK ID193693
Ports & interfaces
USB ports quantityN
USB version2.0/3.2 Gen 1 (3.1 Gen 1)
Processor
Processor modelD-1637
PCI Express slots version2.0,3.0
Processor familyIntel® Xeon® D
Processor socketFCBGA1667
Thermal Design Power (TDP)55 W
Processor manufacturerIntel
Processor boost frequency3.2 GHz
Processor cores6
Processor threads12
Processor cache9 MB
CPU configuration (max)1
Processor lithography14 nm
Processor operating modes64-bit
Processor package size37.5 x 37.5 mm
Scalability1S
On-board graphics card modelNot available
Maximum internal memory supported by processor128 GB
Processor special features
Memory types supported by processorDDR4-SDRAM,DDR3-SDRAM
Maximum number of PCI Express lanes32
Embedded options availableN
Enhanced Intel SpeedStep TechnologyY
Execute Disable BitY
Idle StatesY
Intel 64Y
Intel Trusted Execution TechnologyY
Intel TSX-NIY
Intel Virtualization Technology (VT-x)Y
Intel VT-x with Extended Page Tables (EPT)Y
Intel® AES New Instructions (Intel® AES-NI)Y
Intel® OS GuardY
Intel® Secure KeyY
Intel® Turbo Boost Technology2.0
Thermal Monitoring TechnologiesY
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Products specifications
Attribute nameAttribute value
Commodity Classification Automated Tracking System (CCATS)G168319
Supported instruction sets2.4 GHz
Intel® Optane™ Memory ReadyLaunched
Export Control Classification Number (ECCN)5A002R
Supported memory typesDDR4-SDRAM,DDR3-SDRAM
Intel® Turbo Boost Technology 2.0 frequencyN
Tjunction105 °C
Memory clock speeds supported by processor2400 MHz
Tcase77 °C
Processor base frequency2.9 GHz
Market segmentServer
Launch dateQ2'19
Intel® Transactional Synchronization ExtensionsY
Intel QuickAssist TechnologyN
Intel® Boot GuardN
Memory speed (max)2400 MHz
General Purpose IOYes
Maximum Memory128 GB
Maximum internal memory128 GB
On-board graphics cardN
Discrete graphics card modelNot available
Discrete graphics cardN
Intel Software Guard Extensions (Intel SGX)N
Total number of SATA connectors6
Cooler includedN
Harmonized System (HS) code8542310001
BoxN
StatusLaunched
Number of SATA III connectors6
Integrated LANN
Intel ME Firmware Version3
Intel Quiet System Technology (QST)N
Features
Product typeIntel
Component forServer/workstation
ECCY
Memory channelsDual-channel
Other features
Processor ARK ID193693
Ports & interfaces
USB ports quantityN
USB version2.0/3.2 Gen 1 (3.1 Gen 1)
Processor
Processor modelD-1637
PCI Express slots version2.0,3.0
Processor familyIntel® Xeon® D
Processor socketFCBGA1667
Thermal Design Power (TDP)55 W
Processor manufacturerIntel
Processor boost frequency3.2 GHz
Processor cores6
Processor threads12
Processor cache9 MB
CPU configuration (max)1
Processor lithography14 nm
Processor operating modes64-bit
Processor package size37.5 x 37.5 mm
Scalability1S
On-board graphics card modelNot available
Maximum internal memory supported by processor128 GB
Processor special features
Memory types supported by processorDDR4-SDRAM,DDR3-SDRAM
Maximum number of PCI Express lanes32
Embedded options availableN
Enhanced Intel SpeedStep TechnologyY
Execute Disable BitY
Idle StatesY
Intel 64Y
Intel Trusted Execution TechnologyY
Intel TSX-NIY
Intel Virtualization Technology (VT-x)Y
Intel VT-x with Extended Page Tables (EPT)Y
Intel® AES New Instructions (Intel® AES-NI)Y
Intel® OS GuardY
Intel® Secure KeyY
Intel® Turbo Boost Technology2.0
Thermal Monitoring TechnologiesY
Product tags
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