Intel

Intel E810-XXVDA2 f/ OCP 3.0. Internal. Connectivity technology: Wired, Host interface: PCI Express, Interface: Fiber. Product color: Black, Green, Silver

Intel RS3UC080J. Supported storage drive interfaces: SAS, Serial ATA, Host interface: PCI Express x8. RAID levels: JBOD, Data transfer rate: 12 Gbit/s, Form factor: Low Profile MD2 Card. Processor family: LSI. Compatible operating systems: Windows, Linux, VMWare. Packaging content: One Intel RAID Controller RS3UC080J with full and low profile brackets

Intel Core i5-13400F. Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Processor package size: 45 x 37.5 mm. L2 cache: 9728 KB

Intel Core i5-14400F. Processor family: Intel® Core™ i5, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Processor package size: 45 x 37.5 mm. L2 cache: 9728 KB, Maximum internal memory: 192 GB

Intel Xeon E3-1220V5. Processor family: Intel® Xeon® E3 v5, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.5 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

Intel Xeon ® ® E-2314 Processor (8M Cache, 2.80 GHz). Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4,2x8+1x4,1x8+3x4, Supported instruction sets: SSE4.1,SSE4.2,AVX 2.0,AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.5 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Processor package size: 37.5 x 37.5 mm