Kingston Technology KSM26RD4/32HDI memory module 32 GB 1 x 32 GB DDR4 2666 MHz ECC1

Kingston Technology KSM26RD4/32HDI memory module 32 GB 1 x 32 GB DDR4 2666 MHz ECC

Kingston Technology KSM26RD4/32HDI. Component for: PC/server, Internal memory: 32 GB, Memory layout (modules x size): 1 x 32 GB, Internal memory type: DDR4, Memory clock speed: 2666 MHz, Memory form factor: 288-pin DIMM, CAS latency: 19, ECC

Manufacturer: Kingston Technology

Availability: Out of Stock - on backorder and will be dispatched once in stock.

SKU: 5866343

Manufacturer part number: KSM26RD4/32HDI

UPC: 0740617308174

MSRP: $191.00

Price: $154.66

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Kingston's KSM26RD4/32HDI is a 4G x 72-bit (32GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx4, ECC, memory module, based on thirty-six 2G x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

16 internal banks
Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Supports ECC error correction and detection
On-Die Termination (ODT)
Temperature sensor with integrated SPD
This product is in compliance with the RoHS directive
Per DRAM Addressability is supported
Internal Vref DQ level generation is available
Write CRC is supported at all speed grades
CA parity (Command/Address Parity) mode is supported

Overview
Specifications
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16 internal banks
Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Supports ECC error correction and detection
On-Die Termination (ODT)
Temperature sensor with integrated SPD
This product is in compliance with the RoHS directive
Per DRAM Addressability is supported
Internal Vref DQ level generation is available
Write CRC is supported at all speed grades
CA parity (Command/Address Parity) mode is supported

Products specifications

Attribute name	Attribute value
Height	1.23"
Row cycle time	46.25 ns
Width	5.25"
JEDEC standard	Y
Harmonized System (HS) code	84733020
Refresh row cycle time	350 ns
Row active time	32 ns
Technical details
Sustainability certificates	RoHS
Features
Module configuration	4096M x 64
Internal memory	32 GB
Internal memory type	DDR4
Memory clock speed	2666 MHz
Component for	PC/server
Memory form factor	288-pin DIMM
ECC	Y
CAS latency	19
Memory voltage	1.2 V
Memory layout (modules x size)	1 x 32 GB
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C

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Products specifications

Attribute name	Attribute value
Height	1.23"
Row cycle time	46.25 ns
Width	5.25"
JEDEC standard	Y
Harmonized System (HS) code	84733020
Refresh row cycle time	350 ns
Row active time	32 ns
Technical details
Sustainability certificates	RoHS
Features
Module configuration	4096M x 64
Internal memory	32 GB
Internal memory type	DDR4
Memory clock speed	2666 MHz
Component for	PC/server
Memory form factor	288-pin DIMM
ECC	Y
CAS latency	19
Memory voltage	1.2 V
Memory layout (modules x size)	1 x 32 GB
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C

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