Lenovo Intel Xeon Gold 5218 processor 2.3 GHz 22 MB L31

Lenovo Intel Xeon Gold 5218 processor 2.3 GHz 22 MB L3

Lenovo Intel Xeon Gold 5218. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1000 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S

Manufacturer: Lenovo

SKU: 5570972

Manufacturer part number: 4XG7A14266

$1,999.00

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Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows: - Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor - Processors with an M suffix (eg 8260M): Up to 2 TB per processor - All other processors: Up to 1 TB per processor The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server. For example: - A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required - A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required - A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used) - A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required The following table lists the features of the supported second-generation Intel Xeon processors.

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Products specifications

Attribute name	Attribute value
On-board graphics card	N
Discrete graphics card model	Not available
Supported instruction sets	AVX-512
Memory clock speeds supported by processor	2667 MHz
Tcase	87 °C
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.3 GHz
Intel® vPro™ Platform Eligibility	Y
Discrete graphics card	N
Cooler included	N
Box	N
Market segment	Server
Intel Turbo Boost Max Technology 3.0	N
Intel® Speed Shift Technology	Y
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Component for	Server/workstation
ECC	Y
Memory channels	Hexa-channel
Processor
Processor family	Intel® Xeon® Gold
Processor model	5218
Processor boost frequency	3.9 GHz
Processor cores	16
Processor threads	32
Processor cache	22 MB
Bus type	UPI
PCI Express slots version	3.0
Processor cache type	L3
Processor lithography	14 nm
Processor operating modes	64-bit
Processor socket	LGA 3647 (Socket P)
Scalability	4S
Stepping	B1
Thermal Design Power (TDP)	125 W
On-board graphics card model	Not available
Maximum internal memory supported by processor	1000 GB
Processor special features
Embedded options available	N
Enhanced Intel SpeedStep Technology	Y
Execute Disable Bit	Y
Intel 64	Y
Intel Trusted Execution Technology	Y
Intel TSX-NI	Y
Intel Virtualization Technology (VT-x)	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® AES New Instructions (Intel® AES-NI)	Y
Intel® Turbo Boost Technology	2.0
Maximum number of PCI Express lanes	48
Memory types supported by processor	DDR4-SDRAM

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Products specifications

Attribute name	Attribute value
On-board graphics card	N
Discrete graphics card model	Not available
Supported instruction sets	AVX-512
Memory clock speeds supported by processor	2667 MHz
Tcase	87 °C
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.3 GHz
Intel® vPro™ Platform Eligibility	Y
Discrete graphics card	N
Cooler included	N
Box	N
Market segment	Server
Intel Turbo Boost Max Technology 3.0	N
Intel® Speed Shift Technology	Y
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Component for	Server/workstation
ECC	Y
Memory channels	Hexa-channel
Processor
Processor family	Intel® Xeon® Gold
Processor model	5218
Processor boost frequency	3.9 GHz
Processor cores	16
Processor threads	32
Processor cache	22 MB
Bus type	UPI
PCI Express slots version	3.0
Processor cache type	L3
Processor lithography	14 nm
Processor operating modes	64-bit
Processor socket	LGA 3647 (Socket P)
Scalability	4S
Stepping	B1
Thermal Design Power (TDP)	125 W
On-board graphics card model	Not available
Maximum internal memory supported by processor	1000 GB
Processor special features
Embedded options available	N
Enhanced Intel SpeedStep Technology	Y
Execute Disable Bit	Y
Intel 64	Y
Intel Trusted Execution Technology	Y
Intel TSX-NI	Y
Intel Virtualization Technology (VT-x)	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® AES New Instructions (Intel® AES-NI)	Y
Intel® Turbo Boost Technology	2.0
Maximum number of PCI Express lanes	48
Memory types supported by processor	DDR4-SDRAM

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