Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Products specifications
Attribute name | Attribute value |
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System bus rate | 9.6 GT/s |
Memory clock speeds supported by processor | 2400 MHz |
Tcase | 78 °C |
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
On-board graphics card | No |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Optane™ Memory Ready | No |
Harmonized System (HS) code | 85423119 |
Market segment | Server |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Component for | Server/workstation |
Memory channels | Hexa-channel |
ECC | Yes |
Processor ARK ID | 123550 |
Processor family | Intel® Xeon® |
Processor model | 4114 |
Processor boost frequency | 3 GHz |
Processor cores | 10 |
Processor threads | 20 |
Processor cache | 13.75 MB |
PCI Express slots version | 3.0 |
Processor cache type | L3 |
Processor codename | Skylake |
Processor lithography | 14 nm |
Processor operating modes | 64-bit |
Processor package size | 76 x 56.5 mm |
Processor socket | LGA 3647 (Socket P) |
Thermal Design Power (TDP) | 85 W |
Maximum internal memory supported by processor | 768 GB |
Conflict-Free processor | Yes |
Intel® Turbo Boost Technology | 2.0 |
Maximum number of PCI Express lanes | 48 |
Memory types supported by processor | DDR4-SDRAM |
Embedded options available | No |
Intel 64 | Yes |
Intel Trusted Execution Technology | Yes |
Intel TSX-NI | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |