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6214400
Lenovo EPYC AMD 7313. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor manufacturer: AMD. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz. Market segment: Server
3006377
AMD Opteron 6274. Processor manufacturer: AMD
4963145
Lenovo Intel Xeon Silver 4110. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR550
4963120
Lenovo Intel Xeon Silver 4110. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR530
7130848
Intel Xeon Silver 4410Y. Processor family: Intel Xeon Silver, Processor socket: FCLGA4677, Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 64 GB, Intel® Data Streaming Accelerator (DSA): 1 default devices. Package type: Retail box
11576762
Cisco Xeon Bronze 3106 (11M Cache, 1.70 GHz). Processor family: Intel Xeon Bronze, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Processor package size: 76 x 56.5 mm. Maximum internal memory: 786432 MB
5076684
Lenovo Intel Xeon Silver 4114T. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S
4974043
Lenovo Intel Xeon Silver 4116. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SD530
5877238
Lenovo AMD EPYC 7262. Processor family: AMD EPYC, Processor socket: Socket SP3, Processor lithography: 7 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM, Memory clock speeds supported by processor: 3200 MHz
4516225
Lenovo Intel Xeon E5-2690 v4. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1.54 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S
4045743
IBM E5-2680 v2 10C 2.8GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Compatibility: IBM System x3550 M4
4963207
Lenovo Intel Xeon Gold 5118. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: S4S. Processor package size: 76 x 56.5 mm. Compatibility: Lenovo ThinkSystem SR630
5401212
Oracle Intel Xeon Silver 4114. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S
3397879
AMD Opteron 6348. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.576 MB, Temperature (max): 70.4 °C
3397881
AMD Opteron 6366 HE. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory clock speeds supported by processor: 1800 MHz. Market segment: Server
11291819
Cisco Xeon 1.70 GHz E5-2609 v4/85W 8C/20MB. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011 (Socket R), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S
3397876
AMD Opteron 6328. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.384 MB, Temperature (max): 71.7 °C
3397880
AMD Opteron 6348. Processor family: AMD Opteron, Processor socket: Socket G34, Processor lithography: 32 nm. Memory types supported by processor: DDR3-SDRAM, Memory clock speeds supported by processor: 1333,1600 MHz. Market segment: Server, Processing Die size: 315 mm². L1 cache: 0.576 MB, Temperature (max): 70.4 °C