Alternate color or configuration shown Transcend MTE662T2 M.2 2000 GB PCI Express 3.0 3D NAND NVMe Transcend MTE662T2. SSD capacity: 2000 GB, SSD form factor: M.2, Read speed: 3500 MB/s, Write speed: 2700 MB/s Manufacturer: Transcend SKU: 6626658 Manufacturer part number: TS2TMTE662T2 UPC: 0760557845058 MSRP: $469.99 Price: $462.38 Qty: Add to cart Custom wishlist OK Add to wishlist Add to compare list Email a friend Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃. DRAM Cache embedded30µ" PCB gold fingerEndurance: 3K P/E cycles (Program/Erase cycles) guaranteedPCIe Gen 3 x4 interfaceKey components fortified by default with Corner Bond technologyCompliant with PCI Express specification 3.1Compliant with NVM Express specification 1.3Supports NVM commandSLC caching technologyBuilt-in LDPC ECC (Error Correction Code) functionality Overview Specifications Contact Us Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃. DRAM Cache embedded30µ" PCB gold fingerEndurance: 3K P/E cycles (Program/Erase cycles) guaranteedPCIe Gen 3 x4 interfaceKey components fortified by default with Corner Bond technologyCompliant with PCI Express specification 3.1Compliant with NVM Express specification 1.3Supports NVM commandSLC caching technologyBuilt-in LDPC ECC (Error Correction Code) functionality Products specifications Attribute name Attribute value Height 0.141" Weight 0.317 oz TBW rating 4400 Depth 0.866" SSD capacity 2000 GB Width 3.15" Features Write speed 2700 MB/s Random write (4KB) 355000 IOPS Mean time between failures (MTBF) 3000000 h Memory type 3D NAND Read speed 3500 MB/s Random read (4KB) 340000 IOPS NVMe Y SSD form factor M.2 Ports & interfaces Interface PCI Express 3.0 Power Power consumption (sleep) 1500 G Power consumption (read) 6.9 W Operating voltage 3.3 V Operational conditions Operating temperature (T-T) -20 - 75 °C Storage temperature (T-T) -55 - 85 °C Your name * Your email * Enquiry * Submit Products specifications Attribute name Attribute value Height 0.141" Weight 0.317 oz TBW rating 4400 Depth 0.866" SSD capacity 2000 GB Width 3.15" Features Write speed 2700 MB/s Random write (4KB) 355000 IOPS Mean time between failures (MTBF) 3000000 h Memory type 3D NAND Read speed 3500 MB/s Random read (4KB) 340000 IOPS NVMe Y SSD form factor M.2 Ports & interfaces Interface PCI Express 3.0 Power Power consumption (sleep) 1500 G Power consumption (read) 6.9 W Operating voltage 3.3 V Operational conditions Operating temperature (T-T) -20 - 75 °C Storage temperature (T-T) -55 - 85 °C Product tags (51508)